Lifecycle Status  

ACTIVE (Last Updated: 4 days ago)

Factory Lead Time  

12 Weeks

Mount  

Surface Mount

Package / Case  

423-LFBGA, FCBGA

Number of Pins  

423

Memory Types  

L2 Cache, ROM, SRAM

Operating Temperature  

0°C~90°C TJ

Packaging  

Tray

Series  

OMAP-35xx

JESD-609 Code  

e1

Part Status  

Active

Moisture Sensitivity Level (MSL)  

4 (72 Hours)

Number of Terminations  

423

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

260

Supply Voltage  

1.8V

Terminal Pitch  

0.65mm

Frequency  

720MHz

Base Part Number  

OMAP3503

Pin Count  

423

Voltage  

1.35V

Interface  

I2C, SPI, UART, USB

Max Supply Voltage  

1.89V

Min Supply Voltage  

1.71V

uPs/uCs/Peripheral ICs Type  

DIGITAL SIGNAL PROCESSOR, OTHER

Core Processor  

ARM® Cortex®-A8

Data Bus Width  

32b

Core Architecture  

ARM

Boundary Scan  

YES

Low Power Mode  

YES

Format  

FLOATING POINT

Integrated Cache  

YES

RAM (words)  

64000

Voltage - I/O  

1.8V 3.0V

Number of UART Channels  

3

Number of Cores/Bus Width  

1 Core 32-Bit

Graphics Acceleration  

No

RAM Controllers  

LPDDR

USB  

USB 1.x (3), USB 2.0 (1)

Additional Interfaces  

HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

Number of Timers  

15

Co-Processors/DSP  

Multimedia; NEON™ SIMD

ROM Programmability  

MROM

Barrel Shifter  

NO

Internal Bus Architecture  

SINGLE

Display & Interface Controllers  

LCD

Height  

1.4mm

Length  

16mm

Width  

16mm

Thickness  

960μm

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free